 
|
 |
|
 |
| Material |
XPC,
FR1, FR2, CEM1, CEM3, FR4 |
| Finish |
Flux,
Entek, HAL, Ni/Au |
| Technology |
silver,
carbin links CNC Routing & Punching |
|
|
|
|
|
 |
| Material |
PHT-FR4,
CEM3, 2L NPTH-FR2, cem1, cem3, FR4 |
| Option |
Silver
Paste through hole / Carbon Paste through
hole |
| Finish |
Flux,
Entek, HAL, and etc |
| Technology |
Using
a controlled print-process to achieve conductivity
of 2 sides of a PCB. No plating is required |
|
|
|
|
|
 |
| Line
and Space Width |
|
Down to 0.004",
0.1mm |
|
|
|
| Material |
|
FR4, High Tg
material, and others available |
|
|
|
| Layer
Count |
|
Up to 8 layers |
|
|
|
|
|
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